Today virtually all chips on the market are flat, two dimensional designs. While this is somewhat efficient from a cooling perspective, it offers definite limitations in terms of computing resources per given space. A 3D chip could theoretically be much more compact, while being equally efficient. This would have the added perk that it could reduce defects, as larger dies typically lead to more defects. It would also limit propagation delays by shortening interconnects and make the chip harder to reverse engineer.

While some chips designs have claimed to be "3D", most of these designs are merely stacked chips with a few communications interconnects and not mass interoperation between stacked layers. Now the University of Rochester has demoed perhaps the first true 3D processor design. The chip is optimized in 3 dimensions and runs at a speedy 1.4 GHz. Its unique design allows it to become the first chip to offer full functionality in three dimensions in tasks involving synchronicity, power distribution, and long-distance signaling.

"I call it a cube now, because it's not just a chip anymore. This is the way computing is going to have to be done in the future. When the chips are flush against each other, they can do things you could never do with a regular 2-D chip," stated Eby Friedman, Distinguished Professor of Electrical and Computer Engineering at Rochester and faculty director of the processor.

You can read the entire article at Dailytech.