It sounds like Nvidia's G92, the next-gen high-end part, is having heat problems. Several people told us that a few weeks ago, they got an urgent letter from NV to send them computers that the new G92 would go in for 'thermal analysis'. Hmmm, makes you wonder, doesn't it? More interestingly, the OEMs: several told the same story, said they were given about a week to comply, slap it in a box and FexEx that sucker, ASAP.

Other than 'thermal analysis' and 'do it now', no explanation was given. That really made us wonder. It sounds like a cooling problem, not a die problem. The die itself is far smaller than the ~480mm^2 of the G80,. Those seen by our moles are just over 17*17mm or 289 mm^2 on a 65nm process. If you do the math, (.65 * .65)/(.80 * .80) * 480 mm^2 gives you about what you would expect for a more or less simple shrink with a few tweaks.

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